High Temperature Sealing Paste

CAP-552

This sealing paste is recommended for gas-tight, hard-bonding SOFC cells to metals and ceramics and can be used in both button cell testing and stack development. It has the best rating for bonding to Ni-Fe metal alloys

Description

This paste works best for ceramic to ceramic or ceramic to metal bonding and for SOFC components. It is also excellent for low coefficient of expansion (Low CTE) metals. This can be used for temperatures up to 1760oC.

Standard packing is of 475 ml and custom orders are also possible. Please send us a message with your detailed requirement and we will get back to you.

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